Ultra Soft Thermal Conductive Gap Filler 20shore00 3.5mmT For IT Infrastructure

Ziitek TIF5140-50-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

TIF500-50-11US Datasheet-REV02.pdf

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market.

Our vast experience allows us to assist our customers best in thermal engineering field.

We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

<Good thermal conductive:5.0W/m-k

<Thickness:3.5mmT

<High durability

<High tack surface reduces contact resistance

<Moldability for complex parts

<IT infrastructure

<GPS navigation and other portable devices

<notebook

<power supply

<LED Controller

<LED Ceilinglamp

<Monitoring the Power Box