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Brand Name : Ziitek
Model Number : TIF1120-40-11US thermal pad
Certification : UL
Place of Origin : China
MOQ : 1000 pcs
Price : 0.1-10 USD/PCS
Payment Terms : T/T
Supply Ability : 100000pcs/month
Delivery Time : 3-8 work days
Packaging Details : 25*24*13cm canton
Color : gray
Density : 3.15g/cm3
thermal conductive : 4.0W/mK
hardness : 20 shore00
name : TIF1120-40-11US Thermal Conductive Silicone Pad For Memory Modules
keyword : thermal gap pad
Outstanding thermal performance TIF1120-40-11US thermal pad for Memory Modules
Company Profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
<Available in varies thicknesses
<Broad range of hardnesses available
<Moldability for complex parts
<Automotive engine control units
<Telecommunication hardware
<Handheld portable electronics
<Semiconductor automated test equipment (ATE)
<CPU
<display card
Typical Properties of TIF1120-40-11US | |||
Product Name | TIF1120-40-11US Series | ||
Colour | gray | ||
Construction & Compostion | Ceramic filled silicone elastomer | ||
Specific gravity | 3.15 g/cc | ||
Thickness | 3.0mmT | ||
Hardness | 20 Shore 00 | ||
Dielectric constant@1MHz | 4.0 MHz | ||
Continuos Use Temp | -40to 160℃ | ||
Dielectric Breakdown Voltage | >5500 VAC | ||
Thermal conductivity | 4.0 W/mK | ||
Volume Resistiviyt | 6.0*1012 Ohm-cm |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Independent R&D team
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
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FAQ
Q:How can we get detailed price list?
A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.
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TIF1120-40-11US Thermal Conductive Silicone Pad For Memory Modules Images |