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3W/MK Thermal Conductive Gap Filler Pads For Cooling Components To The Chassis Of Frame

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Dongguan Ziitek Electronical Material and Technology Ltd.

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3W/MK Thermal Conductive Gap Filler Pads For Cooling Components To The Chassis Of Frame

Name: 3WMK Thermal Conductive Gap Filler Pads For Cooling Components To The Chassis Of Frame
Brand: Ziitek
Price: 0.1 USD

China 3W/MK Thermal Conductive Gap Filler Pads For Cooling Components To The Chassis Of Frame wholesale

Brand Name : Ziitek

Model Number : TIF500S Series

Certification : UL & RoHS

Place of Origin : China

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 1000000 pcs/month

Delivery Time : 3-5 work days

Packaging Details : 24*23*12cm cantons

Products name : 3W/mK Thermal Conductive Gap Filler Pads For Cooling Components To The Chassis Of Frame

keyword : easily attached thermal gap filler

application : LED panel light

thermal conductivity : 3W/mK

feature : China supplier

Keywords : thermal gap Pad filler

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3W/mK Thermal Conductive Gap Filler Pads For Cooling Components To The Chassis Of Frame

The TIF™500S Series TIFTM500s Series thermally conductive interface materials are applied to fillthe air gaps between the heating elements and the heat dissipation fins orthe metal base.Their flexibility and elasticity make them suited to coat veryuneven surfaces.Heat can transmit to the metal housing or dissipation platefrom the heating elements or even the entire PCB, which effecitly enhancesthe efficiency and life-time of the heat-generating electronic components.

Features

> Good thermal conductive
> Soft and compressible for low stress applications
> RoHS compliant
> UL recognized
> Fiberglass reinforced for puncture, shear and tear resistance

Applications

> CPU
> display card
> mainboard/mother board
> notebook
> power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components

Typical Properties of TIF500S Series
Color	Blue	Visual
Construction	Ceramic filled silicone elastomer	**********
Thermal Conductivity	3.2 W/mK	ASTM D5470
Hardness	45 Shore 00	ASTM 2240
Specific Gravity	3.0 g/cc	ASTM D297
Thickness range	0.020"-0.200" (0.5mm-5.0mm)	ASTM D374
Dielectric Breakdown Voltage (T= 1mm above)	>5500 VAC	ASTM D149
Dielectric Constant	5.5 MHz	ASTM D150
Volume Resistivity	1.0X10^¹²Ohm-meter	ASTM D257
Continuous Use Temp	– 40 To 160℃	**********
Outgassing (TML)	40%	ASTM E595
Flame Rating	94-V0	UL E331100

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

Standard Sheets Sizes:
8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.

3W/MK Thermal Conductive Gap Filler Pads For Cooling Components To The Chassis Of Frame

Company profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

Product Tags:

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3W/MK Thermal Conductive Gap Filler Pads For Cooling Components To The Chassis Of Frame

3W/MK Thermal Conductive Gap Filler Pads For Cooling Components To The Chassis Of Frame

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