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High Thermal Conductive Two Component Thermal Gel For Computer And Peripherals

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High Thermal Conductive Two Component Thermal Gel For Computer And Peripherals

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Brand Name : Ziitek

Model Number : TIF080 AB-11S

Certification : UL

Place of Origin : China

MOQ : 1000 pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 100000pcs/month

Delivery Time : 3-8 work days

Packaging Details : 25*13*12cm carton

Name : High Thermal Conductive Two Component Thermal Gel For Computer And Peripherals

Thermal Conductivity : 8.0W/mk

Hardness : 45 Shore 00

Color A/B : White / Gray

Flame Rating : 94V0

Keyword : Thermally Conductive Gel

Application : Computer and peripherals

Suggested Temp Range : -45~200℃

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High Thermal Conductive Two Component Thermal Gel For Computer And Peripherals

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Ziitek TIF®080 AB-11S is a highly thermal conductive, liquid gap filling material. It is provide with two-component and different temperature curing system. The product was supplied as highly thermal conductive, soft and elastomer for coupling on electrical devices modul. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components. It is liquid approach offer variety of thickness, replacing individual die-cut and specific pad thickness. Different from grease, the cured product is dry and can be touch. It can intented for use in thermal applications.

Features

< Good thermal conductive: 8.0W/mK
< Two-part formulation for easy storage
< Excellent low and high temperature mechanical and chemical stability
< Ultra-conforming low-stress interface application
< Ambient or accelerated cure schedules
< Optimized shear thinning characteristics for ease of dispensing
Applications

< Computer and peripherals

< Telecommunications
< Automotive electronics
< Thermally conductive vibrationdampening
< Heat sink and any heatgenerating semicondutor

Typical Properties of TIF®080 AB-11S Series
Typical Uncured Material
Property Numerical Test Method
Color/Part A White Visual
Color/Part B Gray Visual
Fiow Rate (g/min) @75psi 4.5 ******
Density 3.4g/cm³ ASTM D792
Bond line thickness(mm) 0.2 ASTM D374
Mix Ratio 1:1 ******
Shelf Life@25℃ 6 months ******
Cure Schedule
Pot Life @25℃ 30 min ******
Cure @25℃ 120 min ******
Cure @100℃ 30 min ******
Cure Properties
Color Gray Visual
Hardness 45 shore00 ASTM D2240
Continuous Use Temp -45~200℃ ******
Voltage Strength ≥4000 V/mm ASTM D149
Volume Resistivity ＞1.0*1012 Ohm-meter ASTM D257
Flame Rating V-0 UL 94
Thermal Conductivity 8.0W/mK ASTM D5470
Thermal impedance@10psi (℃-in2/W) 0.72 ASTM D5470
Thermal impedance@50psi (℃-in2/W) 0.60 ASTM D5470

Product packing details:


50cc/pc, 48pcs/box; 400cc/pc, 9pcs/box
We offer the custom packaged in Syringes for automated despensing applications. Please contact us for confirming.

High Thermal Conductive Two Component Thermal Gel For Computer And Peripherals

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

FAQ

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.


Product Tags:

Peripherals Thermal Conductive Gel

      

High Thermal Conductive Thermal Gel

      

Computer Thermal Conductive Gel

      
China High Thermal Conductive Two Component Thermal Gel For Computer And Peripherals wholesale

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