Excellent Wet-Out Thermal Pad for High speed mass storage drives,5.0mmT TIF1200-30-11US
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
TIF100-30-11US-Series-Datasheet-.pdf
TIF1200-30-11US is a highly compliant Gap Pad material that is ideal for fragile component leads. The material is fiberglass reinforced for improved puncture resistance and handling TIF1200-30-11US maintains a conformable, yet elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces with high roughness or uneven topography. Ziitek TIF1200-30-11US features an inherent tack on both sides of the material, eliminating the need for thermally impeding adhesive layers.Options and ConfigurationsStandard sheet size - 8" x 16" or custom configurationStandard thickness available - 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200", 0.250"Custom made configurations available upon request
Features
<Good thermal conductive:3.0W/mK
<Thickness:5.0mmT
<Hardness:20±5 Shore 00
<Colour: gray
<Outstanding thermal performance
<High tack surface reduces contact resistance
<Fiberglass reinforced for puncture, shear and tear resistance
<Easy release construction
Applications
<High speed mass storage drives
<Heat Sinking Housing at LED-lit BLU in LCD
<LED TV and LED-lit lamps
<GPS navigation and other portable devices
<CD-Rom, DVD-Rom cooling
<LED Power Supply
<LED Controller
<LED Ceilinglamp
Typical Properties of TIF1200-30-11US |
| Product Name | TIF1200-30-11US Series |
| Colour | gray |
| Construction & Compostion | Ceramic filled silicone elastomer |
| Specific gravity | 3.0 g/cc |
| Thickness | 5.0mmT |
| Hardness | 20±5Shore 00 |
| Dielectric constant@1MHz | 4.0 MHz |
| Continuos Use Temp | -40to 160℃ |
| Dielectric Breakdown Voltage | >5500 VAC |
| Thermal conductivity | 3.0W/mK |
| Volume Resistiviyt | 1.0*1012 Ohm-cm |
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
FAQ
Q: What kind of packaging you offer?
A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
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Thermal Pad For High Speed Mass Storage Drives 5.0mmT TIF1200-30-11US Images
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